Photoresist softbake (SU-8) |
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| Material |
SU-8 |
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| Sides processed |
both |
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| Temperature |
30 .. 150 °C |
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| Wafer size |
|
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| Equipment |
Hotplate
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| Equipment characteristics: |
| Batch sizes |
100 mm: 6, 150 mm: 4, 200 mm: 1, 75 mm: 6 |
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| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat, notched |
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| Wafer holder Device that holds the wafers during processing. |
plate |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
alumina, gallium arsenide, glass (category), silicon |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 3000 µm |
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