Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
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  Al/2% Si DC-magnetron sputtering
Process characteristics:
Thickness
Amount of material added to a wafer
Thickness*
Amount of material added to a wafer, must be 0 .. 1 µm
0 .. 1 µm
Ambient
Ambient to which substrate is exposed during processing
 argon
Material aluminum/silicon [98:2]
Setup time 90 min
Sides processed either
Temperature 23 °C
Wafer size
Wafer size
Equipment CPA 9900 3-Target Sputtering System
Equipment characteristics:
Batch sizes 100 mm: 9, 150 mm: 2
Wafer geometry
Types of wafers this equipment can accept
 1-flat, 2-flat
Wafer holder
Device that holds the wafers during processing.
 palette
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
 300 .. 600 µm