Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  Develop
Process characteristics:
Depth
Thickness of photoresist.
Depth
Thickness of photoresist.
unconstrained
Material
Photoresist to develop.
Material
Photoresist to develop.
Minimum feature size (masked)
The dimension of the smallest feature in the photoresist to remain on the substrate.
Minimum feature size (masked)
The dimension of the smallest feature in the photoresist to remain on the substrate.
unconstrained
Minimum feature size (open)
The dimension of the smallest feature to be etched in the photoresist.
Minimum feature size (open)
The dimension of the smallest feature to be etched in the photoresist.
unconstrained
Sides processed both
Equipment