Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
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  Release etch
Process characteristics:
Depth
Depth to etch in material or the length of undercutting required to release structures on substrate.
Depth
Depth to etch in material or the length of undercutting required to release structures on substrate.
unconstrained
Material
Material to be etched.
Material
Material to be etched.
Min feature size
The dimension of the smallest feature in the structure to be released.
Min feature size
The dimension of the smallest feature in the structure to be released.
unconstrained
Sides processed
Specify whether etching is to occur on a single or both sides of substrate.
Sides processed
Specify whether etching is to occur on a single or both sides of substrate.
Equipment