Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
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  Anisotropic dry etch
Process characteristics:
Aspect ratio
Specify preferred aspect ratio (if known) of etch process. Aspect ratio is defined as (etch depth)/(undercut).
Aspect ratio
Specify preferred aspect ratio (if known) of etch process. Aspect ratio is defined as (etch depth)/(undercut).
unconstrained
Depth
Depth to etch in material.
Depth
Depth to etch in material.
unconstrained
Etching source gases
Specify preferred source gases for the etch process (if known).
Etching source gases
Available  
Selected
Specify preferred source gases for the etch process (if known).
Material
Material to be etched.
Material
Material to be etched.
Minimum feature size (masked)
The dimension of the smallest masked feature to be protected during the etch.
Minimum feature size (masked)
The dimension of the smallest masked feature to be protected during the etch.
unconstrained
Minimum feature size (open)
The dimension of the smallest unmasked (open) feature to be etched.
Minimum feature size (open)
The dimension of the smallest unmasked (open) feature to be etched.
unconstrained
Sides processed either
Equipment