on front Isotropic dry etch |
|
| Process characteristics: |
| Depth Depth to etch in material. |
|
|---|
| Etching source gases Specify preferred source gases for the etch process (if known). |
|
|---|
| Material Material to be etched. |
|
|---|
| Minimum feature size (masked) The dimension of the smallest masked feature to be protected during the etch. |
|
|---|
| Minimum feature size (open) The dimension of the smallest unmasked (open) feature to be etched. |
|
|---|
| Sides processed |
either |
|---|
| Equipment |
|
