Process Hierarchy

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  Pulsed electrodeposition
Process characteristics:
Material
Material to be deposited.
Material
Material to be deposited.
Microstructure
Specify preferred microstructure of deposited film (if known).
Microstructure
Specify preferred microstructure of deposited film (if known).
Residual stress
Specify preferred residual stress in deposited film (if known). Positive values refer to tensile film stress.
Residual stress
Specify preferred residual stress in deposited film (if known). Positive values refer to tensile film stress.
unconstrained
Thickness
Thickness of film to be deposited.
Thickness
Thickness of film to be deposited.
unconstrained
Sides processed either
Equipment
Comments:
  • The substrate is placed in a wet chemical solution containing ions of the material to be deposited. An electrical potential is applied between a metal seed layer on the substrate and a counter electrode in the liquid to induce a redox process (reduction/deposition at seed layer, oxidation at counter electrode). The electrical potential is varied over time (pulsed) to improve the uniformity of the deposition. The process is typically performed on one side of the substrate at a time.