Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
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  Residual stress measurement
Process characteristics:
Thickness
Thickness of film on which the stress is measured.
Thickness
Thickness of film on which the stress is measured.
unconstrained
Sides inspected
The sides of the wafer inspected by the process
 either
Equipment