on front Contact I-line exposure |
|
| Material |
Arch OiR 897-10i |
|---|
| Proximity Separation of mask and wafer (separation of 0 um indicates contact) |
0 µm |
|---|
| Setup time |
30 min |
|---|
| Sides processed |
either |
|---|
| Wavelength Wavelength of light used during the exposure |
365 nm |
|---|
| Wafer size |
|
|---|
| Equipment |
Karl Suss MA6 Mask Aligner |
| Equipment characteristics: |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat |
|---|
| Wafer holder Device that holds the wafers during processing. |
vacuum chuck |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 2000 µm |
|---|
