Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
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  Titanium/Tungsten plasma etch
Process characteristics:
Depth
Depth of material removed by etch process
Depth*
Depth of material removed by etch process, must be 0.01 .. 1 µm
0.01 .. 1 µm
Ambient
Ambient to which substrate is exposed during processing
 chlorine, boron trichloride, nitrogen, sulfur hexafluoride
Batch size 4
Etch rate 0.7 µm/min
Material titanium/tungsten
Min feature size 1 µm
Pressure
Pressure of process chamber during processing
 200 mTorr
Selectivity
Primary material removal rate divided by removal rates of secondary materials (i.e., factors by which primary material is removed faster than secondary materials)
 photoresist (category): 2, silicon dioxide: 6, titanium/tungsten: 1
Sides processed either
Temperature 85 °C
Wafer size
Wafer size
Equipment Applied Materials Precision 5000 (chamber A)
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
 mechanical clamp
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 silicon, quartz (single crystal), silicon on insulator, silicon germanium
Wafer thickness
List or range of wafer thicknesses the tool can accept
 400 .. 750 µm
Comments:
  • This is an MOS clean machine. Resist must be baked @110C at least 24 hrs before etching.
  • No resist allowed on backside of wafers. Resists thicker that 1.6um will burn. Users should consider an alternate masking material.
  • Quartz wafers must have non-transparent material on backside.
  • Endpoint detection available, assuming etch stop material is oxide.