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About MEMS
Prime: View
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Evaporation
LPCVD
Low-stress SiN deposition
Miscellaneous deposition
Oxidation
PECVD
Spin casting
Sputtering
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at
engineering@mems-exchange.org
or call us at (703) 262-5368
on front
Prime
Process characteristics:
Material
Material to be deposited.
Material
HMDS
other
Material to be deposited.
Sides processed
Specify whether deposition is to occur on a single or both sides of substrate.
Sides processed
both
either
Specify whether deposition is to occur on a single or both sides of substrate.
Equipment
Comments:
A priming (or prime) process is used to deposit a molecular monolayer of a material on the surface of the substrate, typically to promote adhesion of another material to the substrate. It can be done by placing the substrate in a low pressure chamber to which a vapor of the material to deposited is supplied or by spin casting a liquid solution of the material on the substrate. The process is performed on either one or both sides of the substrate depending on the method.