Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  RCA clean
Batch size 25
Sides processed both
Temperature 85 °C
Wafer size
Wafer size
Equipment PFC bench
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
 teflon chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
 200 .. 1200 µm
Comments:
  • Effective organic and metal contaminant surface cleaning process.