|
| Batch size |
25 |
|---|
| Depth |
0.1 .. 10 µm |
|---|
| Etchant Solutions and their concentrations. |
sulfuric acid/hydrogen peroxide |
|---|
| Excluded materials |
gold (category), copper |
|---|
| Material |
photoresist (category) |
|---|
| Sides processed |
both |
|---|
| Temperature |
60 .. 70 °C |
|---|
| Wafer size |
|
|---|
| Equipment |
Air Control Microvoid |
| Equipment characteristics: |
| Wafer holder Device that holds the wafers during processing. |
teflon carrier |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, silicon dioxide, Borofloat (Schott), alumina |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 1000 µm |
|---|
| Extra terms |
Customer agrees that wafers, masks, and other materials
incorporating any process(es) provided by this fabrication site
are to be used solely for non-commercial research
purposes.
|
