Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Photoresist coat (Shipley 220)
  1 Dehydration bake
on front
  2 100% HMDS prime
MaterialHMDS
on front
  3 Photoresist coat (Shipley 220)
MaterialShipley 220Thickness7 µm
  4 Soft bake
Material Shipley 220
Resist thickness 7 µm
Wafer size
Wafer size
Comments:
  • The film is softbaked at 90 C for 25 min.