Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
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  Titanium/tungsten plasma etch
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  1 Titanium/Tungsten plasma etch
Materialtitanium/tungsten
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  2 Post-aluminum plasma etch (passivation and strip)
Materialphotoresist (category)
Process characteristics:
Depth
Depth of material removed by etch process
Depth*
Depth of material removed by etch process, must be 0 .. 1 µm
0 .. 1 µm
Material titanium/tungsten
Selectivity
Primary material removal rate divided by removal rates of secondary materials (i.e., factors by which primary material is removed faster than secondary materials)
 photoresist (category): 2, silicon dioxide: 6, titanium/tungsten: 1
Wafer size
Wafer size
Comments:
  • If Chamber D of P5000 not available, manual passivation/strip procedure must be performed.