Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
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  Titanium DC-magnetron sputtering
on front
  1 Titanium DC-magnetron sputtering
Materialtitanium
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  2 Stylus profilometer step measurement
Process characteristics:
Thickness
Amount of material added to a wafer
Thickness*
Amount of material added to a wafer, must be 0 .. 0.35 µm
0 .. 0.35 µm
Batch sizes 100 mm: 9, 150 mm: 2
Material titanium
Wafer size
Wafer size