Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Low-stress polysilicon LPCVD
  1 Piranha clean
  2 Pre-furnace clean
  2.1 RCA clean
  2.2 HF dip
  3 Low-stress polysilicon LPCVD I (100MPa)
MaterialpolysiliconResidual stress50 .. 100 MPa
on front
  4 Spectroscopic ellipsometry film thickness measurement
Thickness0.01 .. 5 µm
Process characteristics:
Recipe
Please select one of the available recipes from the list.
Recipe*
Please select one of the available recipes from the list.
Thickness
Thickness*
must be 0 .. 1 µm
0 .. 1 µm
Batch size 24
Material polysilicon
Wafer size
Wafer size