Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Multipoly Recipe #2
  1 RCA clean with HF Dip (Pre-furnace clean)
  1.1 RCA clean
  1.2 HF Dip
  2 Multipoly process: Recipe #2
MaterialpolysiliconResidual stress29 MPaThickness3.12 µm
on front
  3 Spectrophotometric film thickness measurement
Thickness20 .. 5000 nm
Process characteristics:
Perform clean
Perform clean*
yes no
Excluded materials gold (category), copper
Material polysilicon
Pressure
Pressure of process chamber during processing
 1 atm
Sides processed both
Thickness 3.12 µm
Wafer size
Wafer size
Extra terms
Customer agrees that wafers, masks, and other materials incorporating any process(es) provided by this fabrication site are to be used solely for non-commercial research purposes.