Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Hard baked resist coat (OiR 897 10i)
  1 Dehydration bake
  2 HMDS prime
MaterialHMDS
on front
  3 I-line photoresist coat (OiR 897 10i)
MaterialArch OiR 897-10i
  4 Photoresist hardbake
Materialphotoresist (category)
Process characteristics:
Resist thickness
Resist thickness*
Batch size 12
Material Arch OiR 897-10i
Wafer size
Wafer size