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About MEMS
Photoresist Removal (for metallized wafers, no gold): View
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
Anisotropic etch
Deep RIE
Isotropic etch
Miscellaneous etch
Strip
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at
engineering@mems-exchange.org
or call us at (703) 262-5368
on front
Photoresist Removal (for metallized wafers, no gold)
1
Resist strip
Material
photoresist (category)
on front
2
Photoresist ashing
Depth
0 .. 10 µm
Material
photoresist (category)
Wafer size
Wafer size
100 mm
150 mm
Comments:
For gold-contaminated wafers please use
http://www.mems-exchange.org/catalog/UCB-B-0133/
or
http://www.mems-exchange.org/catalog/UCB-B-0134/