Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Ebeam evaporation (CHA)
on front
  1 Titanium E-beam Evaporation
Materialtitanium
on front
  2 Gold E-beam Evaporation
Materialgold
on front
  3 Stylus profilometer 1-D step measurement
Process characteristics:
Adhesion layer material
Adhesion layer material*
Adhesion layer thickness
If no adhesion layer will be used, enter 0 for this field.
Adhesion layer thickness*
If no adhesion layer will be used, enter 0 for this field. , must be 0 .. 50 nm
0 .. 50 nm
Material
Material*
Perform sheet resistance measurement
One measurement per batch on a monitor wafer
Perform sheet resistance measurement*
yes no
One measurement per batch on a monitor wafer
Thickness
Allowed thickness ranges:
Ag: 0 .. 0.5um
Al: 0 .. 0.2um
Au: 0 .. 1um
Cr: 0 .. 0.5um
Ge: 0 .. 0.025um
Ni: 0 .. 1um
Si: 0 .. 0.750um
Pt: 0 .. 0.1um
Ti: 0 .. 0.1um
Thickness*
Allowed thickness ranges: Ag: 0 .. 0.5um Al: 0 .. 0.2um Au: 0 .. 1um Cr: 0 .. 0.5um Ge: 0 .. 0.025um Ni: 0 .. 1um Si: 0 .. 0.750um Pt: 0 .. 0.1um Ti: 0 .. 0.1um , must be 0 .. 1 µm
0 .. 1 µm
Wafer size
Wafer size
Comments:
  • Metrology includes only one measurement on a monitor wafer per batch.
  • Allowed thickness ranges: (please contact for thicker depositions)
  • Ag: 0 .. 0.5um
  • Al: 0 .. 1um
  • Au: 0 .. 1um
  • Cr: 0 .. 0.5um
  • Cu: 0 .. 1um
  • Ge: 0 .. 0.025um
  • Ni: 0 .. 1um
  • Si: 0 .. 0.05um
  • Pt: 0 .. 0.1um
  • Ti: 0 .. 0.1um