Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Polyimide deposition and curing (Durimide)
on front
  1 Spin casting (Durimide)
  2 Polyimide Softbake (hotplate-Durimide)
  3 Furnace anneal (Nitrogen)
Process characteristics:
Curing temperature
Tube furnace: 300-400C.
Blue M Oven: 200-240C.
Curing temperature*
Tube furnace: 300-400C. Blue M Oven: 200-240C., must be 200 .. 400 °C
200 .. 400 °C
Curing time
Curing time*
must be 30 .. 240 min
30 .. 240 min
Material
32A: Pre-imidized polyimide.
115A: Polyimide pre-cursor
Material*
32A: Pre-imidized polyimide. 115A: Polyimide pre-cursor
PI Curing tool
PI Curing tool*
Thickness
Thickness*
must be 2.7 .. 11 µm
2.7 .. 11 µm
Wafer size
Wafer size