on front Photoresist develop (manual) |
|
| Batch size |
12 |
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| Developer Agent that reacts with masking layer (e.g., photoresist) to etch it selectively. |
MIF300 developer |
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| Material |
photoresist (category) |
|---|
| Process duration |
30 .. 200 s |
|---|
| Selectivity Primary material removal rate divided by removal rates of secondary materials (i.e., factors by which primary material is removed faster than secondary materials) |
photoresist (category): 1 |
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| Sides processed |
either |
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| Wafer size |
|
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| Equipment |
Solvent wet bench |
| Equipment characteristics: |
| Wafer holder Device that holds the wafers during processing. |
teflon carrier |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, glass (category) |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 800 µm |
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