Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
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  Electroplating
Process characteristics:
Material
Material*
Plating area
Area to be plated.
Plating area
Area to be plated., must be 0.31 .. 7850 mm2
0.31 .. 7850 mm2
Thickness
Amount of material added to a wafer
Thickness*
Amount of material added to a wafer, must be 1 .. 30 µm
1 .. 30 µm
Aspect ratio 0.1 .. 15
Sides processed either
Temperature 25 .. 60 °C
Equipment