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About MEMS
Etch: Page 1 of 10
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
Anisotropic etch
Deep RIE
Isotropic etch
Miscellaneous etch
Strip
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
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Process
Advanced silicon dioxide etch (AOE) with photolithography
Silicon DRIE with photolithography (Unaxis VLR 700)
Silicon DRIE with photolithography (PlasmaTherm 770)
HF release & Supercritical dry
Aluminum (1% silicon) plasma etch
Aluminum (1% silicon) wet etch
Aluminum plasma etch
Deep RIE (Bosch process)
Deep RIE (Bosch process) with photolithography
Post-implant photoresist strip (non-metal)
Post-plasma etch photoresist strip (metal)
Silicon dioxide plasma etch (anisotropic)
Silicon dioxide plasma etch (anisotropic, MOS clean)
Titanium plasma etch
Titanium/tungsten plasma etch
Tungsten plasma etch
Aluminum plasma etch
Aluminum wet etch
HF etch
Phosphoric acid etch
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