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About MEMS
Etch: Page 4 of 10
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
Anisotropic etch
Deep RIE
Isotropic etch
Miscellaneous etch
Strip
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
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Process
Silicon nitride ISM high density etch
Silicon nitride RIE (PlasmaLab)
Xenon difluoride (XeF2) Isotropic Si Etch (Xactix)
SiC RIE (AOE)
Photoresist strip (SU-8)
Aluminum wet etch (High power deposition)
Aluminum wet etch (Low power deposition)
Buffered oxide etch
Chromium wet etch (Low and High Power Depositions)
Nickel wet etch (High Power Deposition)
Nickel wet etch (Low Power Deposition)
Photoresist ashing
Photoresist wet strip
Polysilicon RIE
Polysilicon RIE (thick)
Silicon dioxide plasma etch
Silicon nitride RIE
Aluminum RIE
Buffered Oxide Etch (BOE)
HF dip
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