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About MEMS
Miscellaneous deposition: Page 2 of 3
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Evaporation
LPCVD
Low-stress SiN deposition
Miscellaneous deposition
Oxidation
PECVD
Spin casting
Sputtering
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
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Process
Copper electroplating
Gold electroplating
Nickel electroplating (sulfamate)
Nickel electroplating (sulfumate)
Atomic Layer Deposition (ALD)
Alumina (Al2O3) Atomic Layer Deposition (ALD)
Alumina/ Zinc Oxide (Al2O3/ZnO) alloy Atomic Layer Deposition (ALD)
Hafnium dioxide (HfO2) ALD
ZnO Atomic Layer Deposition (ALD)
PTFE Deposition
Reactive Evaporation - Optical film coating (Leybold APS 1104)
Crystalbond 555 bonding (water based)
STS polymer deposition
Electroplating
Electroplating
Dehydration & vapor prime
MVD of Anti-Stiction Coating (DDMS)
MVD of Anti-stiction coating (FOTS)
Polyimide deposition and pattern
Resist bonding
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