Enerjet E-beam |
|
|---|---|
| Model | |
| Type | commercial |
| Comments | |
|
|
| Equipment Characteristics | |
| Wafer diameter(s) List or range of wafer diameters the tool can accept |
50 mm, 75 mm, 100 mm |
| Wafer holder Device that holds the wafers during processing. |
rotating orbital |
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
gallium arsenide, glass (category), indium phosphide, silicon |
| Wafer thickness List or range of wafer thicknesses the tool can accept |
100 .. 1000 µm |