Drytek2 |
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Model | |
Type | commercial |
Equipment Characteristics | |
Batch sizes | 100 mm: 6, 50 mm: 6, 75 mm: 6 |
Piece geometry Geometry of wafer pieces the equipment can accept |
circular, irregular, rectangular |
Piece thickness Range of wafer piece thickness the equipment can accept |
300 .. 600 µm |
Wafer diameter(s) List or range of wafer diameters the tool can accept |
50 mm, 75 mm, 100 mm |
Wafer holder Device that holds the wafers during processing. |
electrode |
Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
quartz (single crystal), silicon, silicon on insulator, silicon on sapphire |
Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 600 µm |