STS DRIE |
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Model | |
Type | commercial |
Equipment Characteristics | |
Batch sizes | 100 mm: 1, 150 mm: 1 |
Wafer diameter(s) List or range of wafer diameters the tool can accept |
100 mm, 150 mm |
Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat |
Wafer holder Device that holds the wafers during processing. |
electrostatic chuck |
Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, silicon on insulator |
Wafer thickness List or range of wafer thicknesses the tool can accept |
100 .. 750 µm |