Unaxis CLC 200 |
|
---|---|
Model | CLC 200 |
Type | commercial |
Equipment Characteristics | |
Batch sizes | 100 mm: 25, 150 mm: 25 |
MOS clean | no |
Wafer diameter(s) List or range of wafer diameters the tool can accept |
100 mm |
Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat |
Wafer holder Device that holds the wafers during processing. |
aluminum chuck |
Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
PZT, silicon |
Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 600 µm |